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Comparing and Contrasting the Distinctions and Advantages of COB and GOB Encapsulation for LED Display Screens

2023-07-05 1,329

As the widespread application of LED display screens continues, there is a growing demand for higher product quality and display performance. Traditional SMD technology is no longer sufficient to meet the requirements of certain scenarios. As a result, some manufacturers have turned to COB and other technologies or have improved upon SMD technology, with GOB technology being an iteration of SMD encapsulation.

Can GOB technology facilitate a more extensive range of LED display screen applications? How will GOB technology develop in the future market? Let's explore these questions!

Since the development of the LED display screen industry, various encapsulation techniques have emerged, including COB displays. These range from through-hole (LAMP) technology to surface-mount (SMD) technology, and now encompass COB encapsulation technology and GOB encapsulation technology.

What is COB packaging technology?

COB encapsulation technology involves directly affixing LED chips onto a PCB substrate for electrical connection. It primarily addresses the heat dissipation issue in LED display screens. Compared to through-hole and SMD technologies, COB encapsulation offers advantages in terms of space utilization and simplified packaging operations. Currently, COB encapsulation is mainly utilized in products with small pixel pitches.

The advantages of COB encapsulation technology include:

  • Ultra-thin and lightweight: PCB boards with thicknesses ranging from 0.4mm to 1.2mm can be selected according to customer requirements, reducing the weight to one-third of traditional products. This leads to cost savings in structure, transportation, and engineering.
  • Impact resistance: COB products encapsulate LED chips directly within concave positions on the PCB board using cured epoxy resin, resulting in a protruding and robust surface that can withstand impacts.
  • Wide viewing angle: COB encapsulation employs shallow-well spherical emission, achieving a viewing angle of over 175 degrees, close to 180 degrees. This provides excellent optical effects.
  • Strong heat dissipation capability: COB products swiftly transfer heat from the LED core through the copper foils on the PCB board. Strict control of copper foil thickness and immersion gold processes minimizes light decay, thereby extending the lifespan.
  • Scratch-resistant and easy to clean: The protruding spherical surface of the LED chips is smooth and sturdy, making it resistant to impacts and abrasion. In the case of dead pixels, they can be repaired individually without the need for a mask. The screen can be cleaned using water or cloth.
  • All-weather performance: With triple protection treatment against water, moisture, corrosion, dust, static electricity, oxidation, and ultraviolet radiation, COB encapsulation excels in various environmental conditions. It can operate normally within a temperature range of -30 degrees Celsius to 80 degrees Celsius.

What is GOB encapsulation technology?

GOB encapsulation technology is a protective packaging technique for LED chips. It utilizes advanced transparent materials to encapsulate the PCB substrate and LED packaging units, effectively providing ten forms of protection: waterproof, moisture-proof, impact-resistant, scratch-resistant, anti-static, salt-resistant, anti-oxidation, blue-light-blocking, and vibration-resistant.

The advantages of GOB encapsulation technology include:

  • High level of protection: LED display screens employing GOB technology benefit from eight layers of protection, including waterproofing, moisture-proofing, impact resistance, dust prevention, corrosion resistance, blue-light-blocking, salt resistance, and anti-static capabilities. Moreover, GOB technology does not negatively affect heat dissipation and brightness. Rigorous testing has shown that the shielding adhesive even aids in heat dissipation, reducing LED chip damage and enhancing screen stability and longevity.
  • Uniform light source: Through GOB processing, the surface of the LED module presents a flat.

The Difference between COB and GOB:

The disparity between COB and GOB lies in the differences in their manufacturing processes. While COB encapsulation offers a smooth surface and superior protective properties compared to traditional SMD encapsulation techniques, GOB encapsulation incorporates a gluing process on the surface of the screen, providing greater stability to the LED chips and significantly reducing the risk of lamp failure, thereby enhancing overall stability.

Which One Has the Advantage, COB or GOB?

Both COB and GOB have their respective advantages, and there is no definitive standard to determine which encapsulation technology is superior. The choice between COB and GOB encapsulation depends on a comprehensive evaluation of factors such as the installation environment, duration of usage, cost control considerations, and disparities in display performance.

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